Module encapsulation by induction heating

Details Module encapsulation by induction heating Module encapsulation by induction heating

1992-04-30

1996-09-24

Reynolds, Bruce A.

Electric heating

Inductive heating

Metal working

219605, 174 522, 228 205, 361765, B23K 1301

Patent

active

055587950

ABSTRACT:
An induction heating module encapsulation apparatus and method for its use is disclosed. The apparatus comprises a substantially airtight chamber which is composed of ceramic or some other high temperature insulating material in which a cap and a ceramic substrate having semiconductor chips joined thereon are placed. A sealband of solder or other brazing material is placed at the periphery of the cap where the cap and substrate are to be joined. An RF coil, which serves as inductor in the apparatus, the energized by a high frequency generator, generating an electromagnetic field in the radio frequency spectrum. The RF coil is oriented to localize the inducted current at the periphery of the cap and the sealband. The inducted current is dissipated in the form of heat until the sealband is molten. The RF power is then turned off. The chamber is pressurized at this point to prevent heated air underneath the cap from breaching the integrity of the sealband by escaping through the sealband while it is in its molten state. After the sealband has been allowed to cool sufficiently to solidify, the pressure is reduced and the completed module is removed from the chamber. The entire encapsulation process requires ten to fifteen seconds per module assembly.

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Safety and environmental Conditions/Introduction to induction heating (Chapters 1,4,9,12,13)--John Davies.

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