Module cooling system

Heat exchange – Movable heating or cooling surface – Rotary drum

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Details

165 41, 165911, 361700, F28D 1502

Patent

active

053259130

ABSTRACT:
An apparatus is provided for cooling electronic components mounted on a cuit board. The circuit board is placed in thermal contact with a heat sink enclosure that has an interior cavity and a release opening that provides a path from the interior cavity to the external ambient. A meltable pellet blocks the release opening. A wick is bonded to the inside surface of the interior cavity. The device is sealed with a working fluid that permeates the wick. When the components get hot, the heat is transferred through the heat sink enclosure to the working fluid in the wick, causing the working fluid to vaporize. The vapors remain trapped in the interior cavity until the pellet melts, allowing the vapor to be released and the temperature of the heat sink enclosure to be stabilized or lowered.

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