Module comprising IC memory stack dedicated to and structurally

Details Module comprising IC memory stack dedicated to and structurally Module comprising IC memory stack dedicated to and structurally

1992-12-03

1994-09-13

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361728, 361807, 361735, 174260, 257686, H05K 702

Patent

active

053474287

ABSTRACT:
A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.

REFERENCES:
patent: 4706166 (1987-11-01), Go
patent: 4983533 (1991-01-01), Go
patent: 5104820 (1992-04-01), Go

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