Module component and method for manufacturing the same

Details Module component and method for manufacturing the same Module component and method for manufacturing the same

2005-03-17

2010-02-09

Coleman, W. David (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S660000, C257S795000, C257SE23114

Reexamination Certificate

active

07659604

ABSTRACT:
A module component in which mounting components and a conductive partition for dividing into a plurality of circuit blocks are mounted on a substrate. The circuit blocks are covered with a sealing member, which is further covered on its surface with a conductive film to electrically shield the circuit blocks individually. This module component can maintain bending strength, with little warpage by a sufficient shielding effect achieved without increasing the number of manufacturing processes.

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