Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-03-08
2005-03-08
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S763000
Reexamination Certificate
active
06865089
ABSTRACT:
A module board has embedded chips and components. A substrate has at least one large cavity and at least one small cavity, in which the large cavity passes through the substrate and a passive component is set in the small cavity. A heat-dissipation sheet is set at the bottom of the substrate. A first adhesion layer bonds the bottom of the substrate to the heat-dissipation sheet. At least one IC chip is fixed in the large cavity of the substrate by a second adhesion layer. A dielectric filling layer covers the entire surface of the module board and fills all gaps, in which the dielectric filling layer has a plurality of micro vias to expose partial areas of the IC chip, the passive component and the substrate. At least one wiring pattern layer is formed on the dielectric filling layer and provide electrical connection among the IC chip, the passive component, and the substrate.
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patent: 4931853 (1990-06-01), Ohuchi et al.
patent: 5306670 (1994-04-01), Mowatt et al.
patent: 5422513 (1995-06-01), Marcinkiewicz et al.
patent: 5745984 (1998-05-01), Cole et al.
patent: 5998859 (1999-12-01), Griswold et al.
patent: 6555906 (2003-04-01), Towle et al.
Ho Kwun Yao
Kung Moriss
Cuneo Kamand
Dinh Tuan
Rabin & Berdo P.C.
Via Technologies Inc.
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