Radiant energy – Invisible radiant energy responsive electric signalling – Semiconductor system
Reexamination Certificate
2004-10-01
2008-10-21
Porta, David P (Department: 2884)
Radiant energy
Invisible radiant energy responsive electric signalling
Semiconductor system
Reexamination Certificate
active
07439516
ABSTRACT:
A computerized tomography imaging scanner module includes a plurality of scintillators, a plurality of back-illuminated photodiodes optically coupled with the scintillators, a multi-layer substrate having a plurality of substrate electrical conductors to which the photodiodes are electrically coupled, wherein each of the plurality of substrate conductors is connected to a different one of the back-illuminated photodiodes, and a flexible cable having a plurality of flex electrical conductors to which the substrate is electrically coupled, wherein each of the plurality of flex electrical conductors is connected to a different output of the multi-layer substrate.
REFERENCES:
patent: 5284796 (1994-02-01), Nakanishi et al.
patent: 6292529 (2001-09-01), Marcovici et al.
patent: 6392217 (2002-05-01), Teranuma et al.
patent: 6426991 (2002-07-01), Mattson et al.
patent: 6461881 (2002-10-01), Farnworth et al.
patent: 6603209 (2003-08-01), DiStefano et al.
patent: 6707046 (2004-03-01), Possin et al.
patent: 6762473 (2004-07-01), Goushcha et al.
patent: 6862184 (2005-03-01), Shi et al.
patent: 6879032 (2005-04-01), Rosenau et al.
patent: 2002/0085665 (2002-07-01), Hoffman et al.
patent: 2002/0092162 (2002-07-01), Tasi et al.
patent: 2003/0122083 (2003-07-01), Possin et al.
patent: 02054955 (2002-07-01), None
New Photodiode Array Products for Computer Tomography Detectors, Detection Technology, Winter 2000-2001.
S.E. Holland, N. Wang and W.W. Moses, Development of Low Noise, Back-Side Illuminated Silicon Photodiode Arrays, IEEE Transactions on Nuclear Science, vol. 44, #3, Jun. 1997, pp. 443-447.
T.Kwa, P. Sarro and R. Wolffenbuttel, Backside-Illuminated Silicon Photodiode Array for an Integrated Spectrometer, IEEE Transactions on Electron Device vol. 44, #5, May 1997, pp. 761-765
Foreign Official Action/Search Report; Cited References for Netherlands Office Action, dated Jun. 29, 2006, NL Application No. 1030140, 7 pages, including translation.
Life Science Outsourcing, Inc., “Medical Device Link” MDDI's Medical Electronics Manufacturing; Copyright 2000; 5 pages.
Babu Baiju Zacharia
Graves Brian Joseph
Hoffman David Michael
Narayanaswamy Mahesh Raman
Zeman Gregory Scott
Armstrong Teasdale LLP
General Electric Company
Lee Shun
Porta David P
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