Module and a substrate for the module

Details Module and a substrate for the module Module and a substrate for the module

1988-11-16

1990-05-01

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361414, H05K 720

Patent

active

049223771

ABSTRACT:
This invention relates to a module which mounts a plurality of semiconductor devices and to a module substrate that interconnect the semiconductor devices.
This invention has the testing and engineering change pads on the underside of the substrate. This arrangement results in the advantages of: providing a sufficient area for the testing and engineering change pads; improving the package density of semiconductor devices, which in turn leads to higher computation speed; and eliminating the need for a special cooling system during the module testing, simplifying the process of testing. Furthermore, since the signal joint terminals to the semiconductor chips are provided on the surface of the substrate on which the semiconductor chips are mounted and since the power bus joint terminals are provided around the chips on the semiconductor chip-mounting surface of the substrate, it is possible to realize a high density package with high reliability.

REFERENCES:
patent: 4706165 (1987-11-01), Takenaka et al.

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