Modularized redundant heat sink for dissipating heat...

Details Modularized redundant heat sink for dissipating heat... Modularized redundant heat sink for dissipating heat...

2007-12-18

2007-12-18

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S692000, C361S697000, C361S719000, C165S080300, C165S104330, C165S121000, C165S185000, C257S712000, C257S722000, C174S016300

Reexamination Certificate

active

11283974

ABSTRACT:
A modularized redundant heat sink for dissipating heat generated from chips includes an independent rectangular fin whose sides are provided with at least more than two elastic pins, and which is provided with a bottom surface for conducting temperature; a circuit board on which are welded with at least more than two chips having upper surfaces. A bottom surface of the fin is attached to the upper surfaces of at least more than two chips through a heat conducting glue, so as to provide a temperature conducting and heat dissipating to at least more than two chips by one fin.

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