Modularized probe head

Details Modularized probe head Modularized probe head

2005-09-20

2005-09-20

Nguyen, Vinh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010

Reexamination Certificate

active

06946860

ABSTRACT:
A modularized probe head for modularly assembling on a probe card is configured for probing a semiconductor wafer under test. The probe head includes a silicon substrate having an active surface and an opposing back surface. The back surface of the silicon substrate is attached on a holder. The silicon substrate has a plurality of peripheral bond pads and contact pads on its active surface. At least a probing chip is mounted on the active surface of the silicon substrate. The probing chip has probing tips and side electrodes. The side electrodes are connected with the contact pads by means of solder material. The peripheral bonding pads of the silicon substrate are connected with a flexible printed circuit for electrically connecting to a multi-layer printed circuit board of a probe card.

REFERENCES:
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5497079 (1996-03-01), Yamada et al.
patent: 6359456 (2002-03-01), Hembree et al.
patent: 6621710 (2003-09-01), Cheng et al.
patent: 6781392 (2004-08-01), Cheng et al.

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