Modularized electronic instrument packaging system

Details Modularized electronic instrument packaging system Modularized electronic instrument packaging system

1986-06-23

1987-10-13

Kucia, R. R.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

211 41, 361390, 361394, 361395, 361415, H05K 502

Patent

active

047002751

ABSTRACT:
A modularized packaging system for enclosing circuit components of an electronic instrument. That system includes one or more "C" frame modules each having top, bottom and side wall portions interconnected one to the other orthogonally. In addition, there is provided interconnection means for interconnecting, side by side, as many of the "C" frame modules as desired with a side panel provided for closing the outwardly facing open sides, if any, of the outermost "C" frame modules. To complete the package, front and rear end assemblies are provided to close those portions of the interconnected "C" frame modules.

REFERENCES:
patent: 3264525 (1966-08-01), Swengel et al.
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patent: 4442476 (1984-04-01), Lenderking et al.
patent: 4533793 (1985-08-01), Geppert
patent: 4597291 (1986-07-01), Motoyima
patent: 4620265 (1986-10-01), Lerude et al.

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