Modularized electronic component cooling apparatus

Details Modularized electronic component cooling apparatus Modularized electronic component cooling apparatus

1997-10-06

1999-08-24

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361697, 165 803, 165185, H05K 720

Patent

active

059432098

ABSTRACT:
An electronic component cooling apparatus fastened to a CPU package for dissipating heat, including a heat sink module retained in contact with the CPU package, the heat sink module having of radiating fins radially arranged at a top side and a plurality of retaining notches in corners, a fastening device fastened to the CPU package to hold down the heat sink module, the fastening device having a fixed hook and a movable hook at two opposite sides respectively hooked up with respective retainer blocks of the CPU package, and a fan unit module mounted on the heat sink module and controlled to cause currents of air for carrying heat away from the heat sink module.

REFERENCES:
patent: 5377745 (1995-01-01), Hsieh
patent: 5409352 (1995-04-01), Lin
patent: 5506752 (1996-04-01), Kong
patent: 5523918 (1996-06-01), Chiou
patent: 5661638 (1997-08-01), Mira
patent: 5768102 (1998-06-01), Ma

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