Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-10-06
1999-08-24
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361697, 165 803, 165185, H05K 720
Patent
active
059432098
ABSTRACT:
An electronic component cooling apparatus fastened to a CPU package for dissipating heat, including a heat sink module retained in contact with the CPU package, the heat sink module having of radiating fins radially arranged at a top side and a plurality of retaining notches in corners, a fastening device fastened to the CPU package to hold down the heat sink module, the fastening device having a fixed hook and a movable hook at two opposite sides respectively hooked up with respective retainer blocks of the CPU package, and a fan unit module mounted on the heat sink module and controlled to cause currents of air for carrying heat away from the heat sink module.
REFERENCES:
patent: 5377745 (1995-01-01), Hsieh
patent: 5409352 (1995-04-01), Lin
patent: 5506752 (1996-04-01), Kong
patent: 5523918 (1996-06-01), Chiou
patent: 5661638 (1997-08-01), Mira
patent: 5768102 (1998-06-01), Ma
Picard Leo P.
Vortman Anatoly
LandOfFree
Modularized electronic component cooling apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Modularized electronic component cooling apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modularized electronic component cooling apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-472689