Wave transmission lines and networks – Coupling networks – Wave filters including long line elements
Reexamination Certificate
2000-09-29
2001-12-11
Pascal, Robert (Department: 2817)
Wave transmission lines and networks
Coupling networks
Wave filters including long line elements
C333S205000, C333S175000
Reexamination Certificate
active
06329890
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to high frequency filters and, in particular, to a distributed, thin film lumped element band-pass filter theoretically capable of operation at frequencies in the range of 800 MHz to 10.0 GHz.
Varieties of thin film devices have been constructed for high frequency circuits. Most have been directed to microwave applications. Some devices, such as discrete delay line assemblies, have been constructed for higher frequency applications. Delay lines are frequently used to adjust timing inconsistencies at complex circuitry mounted to complex printed circuit boards. Examples of some discrete, multi-layer, delay line devices constructed on ceramic substrates are shown at U.S. Pat. Nos. 5,030,931; 5,365,203; and 5,499,442.
The subject invention provides a discrete, distributed, lumped element, thin film band pass filter. Alternative multi-layer, filter configurations are constructed on ceramic substrates between shielding layers. Resonator, strip line, grounding and necessary termination layers are connected with solder filled vias that extend between the substrates and interconnect elements at the layers.
SUMMARY OF THE INVENTION
It is a primary object of the present invention to provide a shielded, band-pass filter capable of operation at frequencies in the range of 800 MHz to 10.0 GHz
It is a further object of the invention to provide alternative band-pass filter circuits constructed from lumped, thin film components deposited on ceramic substrates.
It is a further object of the invention to provide shielded multi-layer filter circuits, wherein the layers are connected with through vias, and wherein various thin film depositions define lumped impedance circuit components, capacitors at overlapping strip conductors, strip conductors and terminations.
Various of the foregoing objects, advantages and distinctions of the invention can be found in alternative thin film band-pass filter circuits constructed on ceramic substrates. Circuit elements are constructed with discrete and overlapping thin film depositions. The surface area and thickness of the elements are tailored to desired operating characteristics of the circuit. Filled through vias electrically couple the layers and components together and to circuit terminations.
The layers can be pre-processed to determined configurations that permit a range of device characteristics. Specific circuit performance can be obtained by laser trimming the thin film depositions to specific shapes and dimensions, prior to stacking a number of prepared layers and final processing the layers into a desired filter device.
Still other objects, advantages and distinctions of the invention will become more apparent from the following description with respect to the appended drawings. To the extent alternative constructions, improvements or modifications have been considered they are described as appropriate. The description should not be literally construed in limitation of the invention. Rather, the scope of the invention should be broadly interpreted within the scope of the further appended claims.
REFERENCES:
patent: 5644275 (1997-07-01), Ishizaki et al.
patent: 5859473 (1999-01-01), Ikata et al.
patent: 5892415 (1999-04-01), Okamura
patent: 6133809 (2000-10-01), Tomohiro et al.
Broman Mark Hamilton
Brooks Mark
Nguyen Patricia
Pascal Robert
Thin Film Technology Corp.
Tschida D. L.
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