Modular thin film distributed filter

Wave transmission lines and networks – Coupling networks – Wave filters including long line elements

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Details

333205, 333175, H01P 120, H03H 700

Patent

active

061279064

ABSTRACT:
A modular thin film, distributed, lumped element band-pass filter. The filter circuitry is configured on a number of ceramic substrates. The component defining depositions are arranged to overlap and couple to one another with connecting vias. Alternative 800 MHz and 1.9 GHz band-pass filter circuits are disclosed. Bordering ground conductors and covering ground planes shield lumped impedance resonator and overlapping capacitor elements. The layers are configured to accommodate a range of frequencies and permit pre-fabrication with subsequent laser trimming, assembly and packaging.

REFERENCES:
patent: 5703544 (1997-12-01), Hays, III
patent: 5929729 (1999-08-01), Swarup

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