Modular system for delivering hot melt adhesive or other...

Dispensing – Automatic control – Constant weight – volume or pressure control by output

Reexamination Certificate

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Details

C222S001000, C222S061000, C222S063000, C222S146200, C222S146500, C222S255000, C222S333000, C137S884000

Reexamination Certificate

active

07874456

ABSTRACT:
A modular system, for delivering hot melt adhesive materials, comprises a modular metering assembly, having metering stations disposed therein, that is able to be attachably and detachably mounted upon a modular tank assembly. Alternatively, one or more of the metering stations may be disposed externally of the modular metering assembly, and alternatively still further, one or more additional modular metering assemblies may be attachably and detachably connected to the first modular metering assembly. Also disclosed is a closed-loop fluid pressure control system, for independently controlling the pressure of the hot melt adhesive material being conveyed to the metering devices, whereby the working pressures of the hot melt adhesive materials being conveyed to the metering devices can have different working pressures.

REFERENCES:
patent: 3827603 (1974-08-01), Reighard et al.
patent: 4408562 (1983-10-01), DeCamp et al.
patent: 4682710 (1987-07-01), Turner et al.
patent: 4787332 (1988-11-01), Geisel et al.
patent: 4988015 (1991-01-01), Price
patent: 5605720 (1997-02-01), Allen et al.
patent: 5893490 (1999-04-01), Gnyp
patent: 5979794 (1999-11-01), DeFillipi et al.
patent: 6089413 (2000-07-01), Riney et al.
patent: 6171089 (2001-01-01), Oehman, Jr.
patent: 6422428 (2002-07-01), Allen et al.
patent: 6517891 (2003-02-01), Estelle et al.
patent: 6688498 (2004-02-01), McGuffey
patent: 6814310 (2004-11-01), Boger
patent: 7770760 (2010-08-01), McGuffey et al.
patent: 2004/0099752 (2004-05-01), Boger
patent: 2004/0161531 (2004-08-01), Ferber et al.
patent: 101 50 230 (2002-07-01), None
patent: 0 895 234 (1999-02-01), None
patent: 0 936 000 (1999-08-01), None
patent: 1 437 303 (2004-07-01), None
patent: 1 591 167 (2005-11-01), None
patent: WO 99/54055 (1999-10-01), None
patent: WO 02/43878 (2002-06-01), None

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