Modular surface mount component for an electrical device or LED'

Electric lamp and discharge devices – With luminescent solid or liquid material – Solid-state type

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313505, 313512, H01L 3300

Patent

active

RE0366145

ABSTRACT:
Processing techniques for various surface mount modular components provide various structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front side connective strips (22, 24) are formed. Devices (15, 16) are mounted to land areas (13, 34) and wire bonded to connecting pads (14). The front side is coated with epoxy to encapsulate the devices in a layer having an outer surface formed into optional lenses (262, 263). The slab is then separated to provide the modular components.

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patent: 4445132 (1984-04-01), Ichikawa et al.
patent: 4508758 (1985-04-01), Wong
patent: 4525597 (1985-06-01), Abe
patent: 4603496 (1986-08-01), Latz et al.
patent: 4713579 (1987-12-01), Miura

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