Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1989-10-24
1991-12-24
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439331, H01R 909
Patent
active
050747983
ABSTRACT:
A modular socket for an integrated circuit package, wherein a single base is adapted to receive a plurality of replaceable contact modules having a variety of conductive lead counts. The modularity permits tooling of a single base to accommodate a variety of integrated circuit packages.
The socket includes a lid pivotally connected to the base by a hinge and hinge pin. The hinge pin defines a pivot axis which is in a plane with the bottom surface of the lid to limit lateral movement on the contacts carried by the module.
REFERENCES:
patent: 4435724 (1984-03-01), Ralstin
patent: 4593961 (1986-06-01), Cosmo
patent: 4699593 (1987-10-01), Grabbe et al.
patent: 4706161 (1987-11-01), Buckingham
patent: 4921430 (1990-05-01), Matsuoka
Abrams Neil
Hall James D.
Nguyen Khiem
Wells Electronics, Inc.
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