Modular sensor assembly and methods of fabricating the same

Measuring and testing – Vibration – By mechanical waves

Reexamination Certificate

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Reexamination Certificate

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07451651

ABSTRACT:
A modular sensor assembly and methods of fabricating a modular sensor assembly are provided. The modular sensor assembly includes a sensor array coupled to an electronics array in a stacked configuration. The sensor array comprises a plurality of sensor modules, each comprising a plurality of sensor sub-arrays. The electronics array comprises a plurality of integrated circuit modules, each comprising a plurality of integrated circuit chips. The sensor modules may be coupled to the electronics modules via flip chip technology.

REFERENCES:
patent: 6551248 (2003-04-01), Miller et al.
patent: 7309948 (2007-12-01), Kuniyasu et al.
patent: 2003/0013969 (2003-01-01), Erikson et al.
patent: 2004/0054287 (2004-03-01), Stephens
patent: 2004/0236223 (2004-11-01), Barnes et al.
patent: 2006/0075818 (2006-04-01), Huang et al.
patent: 2006/0118939 (2006-06-01), Fisher et al.
patent: 2007/0078345 (2007-04-01), Mo et al.
patent: 2007/0113681 (2007-05-01), Nishimura et al.
patent: 2007/0238993 (2007-10-01), Clarke et al.
patent: 2007/0272020 (2007-11-01), Schneider et al.
patent: WO 2006/018805 (2006-02-01), None
patent: WO 2006/018806 (2006-02-01), None
U.S. Appl. No. 11/003,602, filed Jun. 08, 2006, Fisher.
K-H Becks et al., A MCM-D type Module for the ATLAS Pixel Detector, 1999, Fraunhofer Institute-IZM, Berlin, Germany.

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