Modular semiconductor workpiece processing tool

Details Modular semiconductor workpiece processing tool Modular semiconductor workpiece processing tool

2006-07-11

2006-07-11

Graybill, David E. (Department: 2822)

Metal working

Barrier layer or semiconductor device making

Reexamination Certificate

active

07074246

ABSTRACT:
The present invention provides for a semiconductor workpiece processing tool and methods for handling semiconductor workpiece therein. The semiconductor workpiece processing tool preferably includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool may have a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.

REFERENCES:
patent: 3267010 (1966-08-01), Creutz et al.
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3655549 (1972-04-01), Wild
patent: 3770598 (1973-11-01), Creutz
patent: 3832291 (1974-08-01), Arcilesi et al.
patent: 3968885 (1976-07-01), Hassan et al.
patent: 3995206 (1976-11-01), Aronstein et al.
patent: 4110176 (1978-08-01), Creutz et al.
patent: 4336114 (1982-06-01), Mayer et al.
patent: 4374709 (1983-02-01), Combs
patent: 4431361 (1984-02-01), Bayne
patent: 4449885 (1984-05-01), Hertel et al.
patent: 4693017 (1987-09-01), Oehler et al.
patent: 4789648 (1988-12-01), Chow et al.
patent: 4800818 (1989-01-01), Kawaguchi et al.
patent: 4864239 (1989-09-01), Casarcia et al.
patent: 4924890 (1990-05-01), Giles et al.
patent: 4962726 (1990-10-01), Matsushita et al.
patent: 5026239 (1991-06-01), Chiba et al.
patent: 5054988 (1991-10-01), Shiraiwa
patent: 5055036 (1991-10-01), Asano et al.
patent: 5078852 (1992-01-01), Yee et al.
patent: 5083364 (1992-01-01), Olbrich et al.
patent: 5110248 (1992-05-01), Asano et al.
patent: 5125784 (1992-06-01), Asano
patent: 5167792 (1992-12-01), Kamitakahara et al.
patent: 5168886 (1992-12-01), Thompson
patent: 5168887 (1992-12-01), Thompson et al.
patent: 5172803 (1992-12-01), Lewin et al.
patent: 5174045 (1992-12-01), Thompson et al.
patent: 5178639 (1993-01-01), Nishi
patent: 5180273 (1993-01-01), Sakaya et al.
patent: 5183377 (1993-02-01), Becker et al.
patent: 5186594 (1993-02-01), Toshima et al.
patent: 5232511 (1993-08-01), Bergman
patent: 5235995 (1993-08-01), Bergman et al.
patent: 5238500 (1993-08-01), Bergman
patent: 5252137 (1993-10-01), Tateyama et al.
patent: 5258047 (1993-11-01), Tokisue et al.
patent: 5301700 (1994-04-01), Kamikawa et al.
patent: 5312532 (1994-05-01), Andricacos et al.
patent: 5332445 (1994-07-01), Bergman
patent: 5368711 (1994-11-01), Poris
patent: 5377708 (1995-01-01), Bergman et al.
patent: 5388945 (1995-02-01), Garric et al.
patent: 5391285 (1995-02-01), Lytle et al.
patent: 5405518 (1995-04-01), Hsieh et al.
patent: 5429733 (1995-07-01), Ishida
patent: 5442416 (1995-08-01), Tateyama et al.
patent: 5445484 (1995-08-01), Kato et al.
patent: 5447615 (1995-09-01), Ishida
patent: 5460478 (1995-10-01), Akimoto et al.
patent: 5464313 (1995-11-01), Ohsawa
patent: 5500081 (1996-03-01), Bergman
patent: 5522975 (1996-06-01), Andricacos et al.
patent: 5527390 (1996-06-01), Ono et al.
patent: 5544421 (1996-08-01), Thompson et al.
patent: 5571325 (1996-11-01), Ueyama et al.
patent: 5575611 (1996-11-01), Thompson et al.
patent: 5639206 (1997-06-01), Oda et al.
patent: 5658387 (1997-08-01), Reardon et al.
patent: 5660517 (1997-08-01), Thompson et al.
patent: 5664337 (1997-09-01), Davis et al.
patent: 5678320 (1997-10-01), Thompson et al.
patent: 5687320 (1997-11-01), Thompson et al.
patent: 5700127 (1997-12-01), Harada et al.
patent: 5731678 (1998-03-01), Zila et al.
patent: 5765444 (1998-06-01), Bacchi et al.
patent: 6203582 (2001-03-01), Berner et al.
patent: 6440178 (2002-08-01), Berner et al.
patent: 0047132 (1984-02-01), None
patent: 0452939 (1991-10-01), None
patent: 0582019 (1994-02-01), None
patent: 2217107 (1989-10-01), None
patent: 01048442 (1989-02-01), None
patent: 04293796 (1992-10-01), None
patent: 04-144150 (1993-06-01), None
patent: 05-146984 (1995-03-01), None
patent: WO 95/06326 (1995-03-01), None

Affiliated with

Also associated with

Rating

Modular semiconductor workpiece processing tool does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Modular semiconductor workpiece processing tool, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modular semiconductor workpiece processing tool will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3611169