1990-01-09
1991-08-06
Hille, Rolf
357 74, 357 80, 357 67, H01L 2302, H01L 3902, H01L 2312, H01L 2348
Patent
active
050381989
ABSTRACT:
A modular semiconductor power device has a conductive member consisting of an alumina plate to which copper layers are soldered on opposite sides. A chip is soldered to one of these layers and the other of these layers is soldered in turn to a metal heat sink. The chip is connected to respective copper strips which, in turn, are soldered to thermal strips originally forming part of a frame so that, after the device is encapsulated in a synthetic resin, the connecting members of the frame can be cut away to leave free ends of the latter strips exposed.
REFERENCES:
patent: 4396936 (1983-08-01), McIver et al.
patent: 4518982 (1985-05-01), DuBois et al.
patent: 4615031 (1986-09-01), Eales et al.
Di Cristina Natale
Gandolfi Luciano
Minotti Carlo
Perniciaro Spatrisano Antonio
Dubno Herbert
Hille Rolf
Ostrowski D.
SGS-Thomson Microelectronics S.p.A.
LandOfFree
Modular semiconductor power device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Modular semiconductor power device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modular semiconductor power device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1990861