Modular semiconductor device

Details Modular semiconductor device Modular semiconductor device

1983-09-27

1987-08-25

Lee, John

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 361386, 365226, H01L 3902

Patent

active

046896589

ABSTRACT:
A modular semiconductor device for use as a memory or used in logic circuit electronic equipment, includes a plurality of IC chips mounted on one or both sides of a printed circuit substrate. The IC chips are grouped into at least two groups which are selectively operated. The IC chips in one group are arranged alternately with the IC chips in the order group to provide a substantially uniform temperature distribution, over the substrate, of heat build-up in the substrate due to activation of the IC chips.

REFERENCES:
patent: 3697831 (1972-10-01), Anderson et al.
patent: 3790859 (1974-02-01), Schraeder et al.
patent: 3815106 (1974-06-01), Wiedmann
patent: 4481609 (1984-11-01), Higuchi et al.
Rogers, IBM Tech. Disc. Bull., vol. 13, No. 2, Jul. 1970, "Chip Joining Both Sides of Substrates Simultaneously," p. 396, (357/75).
Crawford et al., IBM Tech. Disc. Bull., vol. 20, No. 11B, Apr. 1978, "High Density Multilayer Ceramic Module," pp. 4471-4773, (357/80). _
Audi, IBM Tech. Discl. Bull., vol. 19, No. 2, Jul. 1976, "Cooling and Minimizing Temperature Gradient in Stacked Modules," p. 414, (357/75).
Gaennsslen, IBM Tech. Discl. Bull., vol. 12, No. 10, Mar. 1970, "Multichip Packaging," p. 1579, (357/75).
Archey et al., IBM Tech. Discl. Bull., vol. 24, No. 3, Aug. 1981, "Microsystem Package for Chips," p. 1657, (365/72).

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