Modular, scalable thermal solution

Details Modular, scalable thermal solution Modular, scalable thermal solution

2006-12-19

2006-12-19

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S690000, C361S695000, C361S696000, C361S697000, C361S701000, C174S015100, C174S016300, C165S080300, C165S104330

Reexamination Certificate

active

07151667

ABSTRACT:
One embodiment of a modular, scalable cooling system includes a core cooling module configured to be thermally coupled to a heat-generating electronic device and a supplemental cooling module configured to be thermally coupled to the core cooling module. A first interface attached to the core cooling module is configured to thermally couple the core cooling module to the supplemental cooling module. The core cooling module and the supplemental cooling module may be used alone or in combination to dissipate heat from the heat-generating electronic device.

REFERENCES:
patent: 6170563 (2001-01-01), Hsieh
patent: 6343478 (2002-02-01), Chang
patent: 6442024 (2002-08-01), Shih
patent: 6452797 (2002-09-01), Konstad
patent: 6587343 (2003-07-01), Novotny et al.
patent: 6958910 (2005-10-01), Tanaka et al.
patent: 6970355 (2005-11-01), Ellsworth et al.
patent: 7002797 (2006-02-01), Wittig
patent: 202 12 754 (2002-11-01), None
patent: WO 02/102124 (2002-12-01), None

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