Modular, scalable thermal solution

Details Modular, scalable thermal solution Modular, scalable thermal solution

2008-03-04

2008-03-04

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S694000, C361S695000, C361S696000, C361S697000, C165S080300, C165S080400, C174S015100

Reexamination Certificate

active

07339789

ABSTRACT:
One embodiment of a modular, scalable cooling system includes a core cooling module configured to be thermally coupled to a heat-generating electronic device and a supplemental cooling module configured to be thermally coupled to the core cooling module. A first interface attached to the core cooling module is configured to thermally couple the core cooling module to the supplemental cooling module. The core cooling module and the supplemental cooling module may be used alone or in combination to dissipate heat from the heat-generating electronic device.

REFERENCES:
patent: 5285347 (1994-02-01), Fox et al.
patent: 5323847 (1994-06-01), Koizumi et al.
patent: 5365749 (1994-11-01), Porter
patent: 5509468 (1996-04-01), Lopez
patent: 5731954 (1998-03-01), Cheon
patent: 6166907 (2000-12-01), Chien
patent: 6170563 (2001-01-01), Hsieh
patent: 6234240 (2001-05-01), Cheon
patent: 6333852 (2001-12-01), Lin
patent: 6343478 (2002-02-01), Chang
patent: 6442024 (2002-08-01), Shih
patent: 6452797 (2002-09-01), Konstad
patent: 6587343 (2003-07-01), Novotny et al.
patent: 6671177 (2003-12-01), Han
patent: 6760222 (2004-07-01), Wang
patent: 6926070 (2005-08-01), Jenkins et al.
patent: 6958910 (2005-10-01), Tanaka et al.
patent: 6970355 (2005-11-01), Ellsworth et al.
patent: 7002797 (2006-02-01), Wittig
patent: 7012807 (2006-03-01), Chu et al.
patent: 7050299 (2006-05-01), Kondo et al.
patent: 7151667 (2006-12-01), Walters et al.
patent: 2003/0128514 (2003-07-01), Inoue
patent: 2005/0243516 (2005-11-01), Stefanoski et al.
patent: 202 12 754 (2002-11-01), None
patent: 0 542 478 (1993-05-01), None
patent: WO 02/102124 (2002-12-01), None

Affiliated with

Also associated with

Rating

Modular, scalable thermal solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Modular, scalable thermal solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modular, scalable thermal solution will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2796602