Modular printhead assembly with thermal expansion compensation

Details Modular printhead assembly with thermal expansion compensation Modular printhead assembly with thermal expansion compensation

2006-05-09

2006-05-09

Meier, Stephen (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S042000

Reexamination Certificate

active

07040736

ABSTRACT:
A printhead assembly with an elongate support member and two or more printhead modules detachably mounted in series along the support member, the support member having a structural component for strengthening the member, and a mounting component for mounting the printhead modules; wherein,the mounting component is connected to the structural component to allow relative thermal expansion.By allowing the structural component of the support to thermally expand relative to the mounting component, the structural components can be strong, inexpensive metal despite the co-efficient of thermal expansion (CTE). Only the mounting component need approximate the CTE of the printhead chips to maintain a suitable alignment of the modules.

REFERENCES:
patent: 5528272 (1996-06-01), Quinn et al.
patent: 5734394 (1998-03-01), Hackleman
patent: 6325488 (2001-12-01), Beerling et al.
patent: 11010861 (1999-01-01), None
patent: 2000280496 (2000-10-01), None
patent: WO 9965691 (1999-12-01), None

Affiliated with

Also associated with

Rating

Modular printhead assembly with thermal expansion compensation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Modular printhead assembly with thermal expansion compensation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modular printhead assembly with thermal expansion compensation will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3588406