Modular power electronics die having integrated cooling apparatu

Details Modular power electronics die having integrated cooling apparatu Modular power electronics die having integrated cooling apparatu

1998-12-23

2000-10-31

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361689, 361699, 361707, 361717, 361784, 361785, 165 803, 165146, 165185, 16510433, 174 163, 257714, H05K 720

Patent

active

061412198

ABSTRACT:
A power electronics device incorporating a modular packaging concept and having an integrated device cooler is disclosed. A modular power electronics die cooler is designed for use with a coolant manifold adapted to circulate a coolant medium past a mounting receptacle. The modular power electronics die cooler comprises a base unit adapted for mounting to the manifold, with the base unit having an upper portion and a lower portion. The upper portion includes a plurality of sidewalls defining an enclosure, and the lower portion includes a heat sink and is adapted for insertion in the manifold receptacle. At least one electronic component is mounted within the enclosure. Accordingly, upon mounting the base unit to the manifold, the heat sink is positioned in the coolant medium and thereby dissipates heat produced by the electronic component.

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