Modular payload arrangement

Aeronautics and astronautics – Spacecraft – Reusable or returnable

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Details

244158R, 2441182, 244131, B64G 122, B64C 106

Patent

active

058396969

ABSTRACT:
A modular payload structure providing standardized thermal, electrical and mechanical interfaces. The modular arrangement of the present invention has fixed radiator panels that have standard thermal and mechanical interfaces, allowing communication modules to "plug in" directly to the payload structure. In the case of high thermo-energy dissipating modules, heat pipes on the modules connect to the thermal interfaces and move energy from the modules to the thermal interfaces of the radiator panel.

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