Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1991-12-11
1993-06-22
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 66, H01R 909, H01R 2372
Patent
active
052212092
ABSTRACT:
A leadless component socket comprises a one- or two-piece leadless component contact socket assembly having a plurality of holes with a respective plurality of spring contacts disposed therein. The socket assembly includes a finger slot or slots to facilitate the manual removal of a chip carrier from the socket and a bias clip and integral keyed corner for assuring proper alignment of the chip carrier with the contacts of the socket assembly. The socket further comprises a cover, a cover support, an insulator assembly and a backup plate or other fastening means for supporting the socket on a printed circuit board. The socket assembly can be configured with a variety of contact terminal ends adapted for a desired mode of circuit board interface. A variety of cover configurations are also accommodated and disclosed. The socket disclosed includes implementations of modular pad array interface for board-to-flex circuit; board-to-board; and board to multi-chip module applications utilizing alternative configurations of substantially rectangular modular blocks.
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Abrams Neil
Augat Inc.
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