Modular packaging system, particularly for electronics

Special receptacle or package – For a building component – Shingle

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

206454, 206519, 220 4C, 220 4D, B65D 8348, B65D 7302, B65D 2102

Patent

active

048239526

ABSTRACT:
A front cover is provided with an open area to accommodate visual displays, keyboards, switches, joy sticks and the like. A back cover, nestingly interfitting therewith, is closed, but provided with a recess, encompassing most of its back area. One or more identical nesting interfitting intermediate frames may be nested and stacked between the back cover and the front cover to form a package of any desired volume. The frames, back cover, and front cover are provided with means for mounting functional elements such as electrical circuit boards. The front cover and intermediate frames are provided with peripheral circumferential ribs. These ribs, and the slots therebetween, provide for a great variety of ways to mount the package, as does the rear recess in the back plate. The front cover may be identical or nearly identical to the intermediate frames. Functional elements may be mounted to the covers and frames during manufacture such that the covers and frames act as protective carriers during manufacture. After assembly, they provide a close package or case for the assembled unit.

REFERENCES:
patent: 2865499 (1958-12-01), Brogren
patent: 2879917 (1959-03-01), Flack
patent: 2895599 (1959-07-01), Moyer
patent: 2898522 (1959-08-01), Handen
patent: 2923400 (1960-02-01), Craig
patent: 3141998 (1964-07-01), Silkman
patent: 3202955 (1965-08-01), McKee
patent: 3258649 (1966-06-01), Arguin
patent: 3384956 (1968-05-01), Flanders et al.
patent: 3639809 (1972-02-01), Phlieger, Jr.
patent: 3655034 (1972-04-01), Stollman
patent: 3714515 (1973-01-01), Lee
patent: 4053943 (1977-10-01), Galvin

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Modular packaging system, particularly for electronics does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Modular packaging system, particularly for electronics, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modular packaging system, particularly for electronics will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1189590

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.