Modular packaging system

Special receptacle or package – For a vehicle

Patent

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Details

206328, 211 41, 312107, 312198, 220 223, B65D 7302

Patent

active

046992707

ABSTRACT:
An electronic component packaging system provides individual structural elements of modules that provide both the strength and the internal structure to mount electrical components such as circuit boards without the use of subracks. The resulting structure provides up to 15 percent more usable space for circuit boards. The modules are constructed as to be easily fixed to one another to form a multiple element modular packaging system.

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