Amplifiers – With semiconductor amplifying device – Including distributed parameter-type coupling
Patent
1977-10-05
1979-11-20
Dahl, Lawrence J.
Amplifiers
With semiconductor amplifying device
Including distributed parameter-type coupling
330 56, 330 61A, 331 56, 331107P, 333137, H03F 360
Patent
active
041752570
ABSTRACT:
A modular microwave power combiner having a plurality of identical microwave diode amplifier circuits grouped in sets within the body of a modular unit which are electrically coupled in parallel to a central cavity sized to be resonant at a single frequency to minimize mismoding thereby enhancing combiner efficiency. A number of waveguides are provided for coupling of the microwave diode in each amplifier circuit to the resonant cavity, and the waveguides are situated on one side of a PC board at the top of each modular unit. Since each of the modular units is essentially identical in physical size and shape, the overall power output of the power combiner can be increased by merely adding additional modular units. The individual modular units are sized to fit top-to-bottom such that the respective resonant cavities are spaced apart by one-half wavelength (.lambda./2) for the parallel electrical coupling of all of the resonating cavities. Each modular unit further includes a water jacket around the diode mounts for conducting heat away from the microwave diode thereby increasing circuit density and decreasing overall housing size.
REFERENCES:
patent: 3378789 (1968-04-01), Gerlach
patent: 3582813 (1971-06-01), Hines
patent: 3962654 (1976-06-01), Corrons et al.
Mastrioanni Rudolph G.
Smith Peter W.
Dahl Lawrence J.
Lange Richard P.
United Technologies Corporation
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