Electrical connectors – With circuit component or comprising connector which fully... – Termination circuit
Reexamination Certificate
1999-04-20
2001-01-23
Witkowski, Stanley J. (Department: 2837)
Electrical connectors
With circuit component or comprising connector which fully...
Termination circuit
C439S676000, C439S825000, C029S877000, C029S882000
Reexamination Certificate
active
06176741
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates generally to miniature electrical connectors used in printed circuit board and other microelectronic applications, and particularly to an improved microelectronic connector and method of fabricating the same.
2. Description of Related Technology
Existing microelectronic electrical connectors, such as those of the RJ 45 or RJ 11 type, frequently incorporate magnetics or other electrical components within the connector body itself These components may provide a variety of electrical or signal conditioning functions, such as noise suppression or signal transformation. Often, the magnetics or electrical component is fabricated as part of a package or separate device and then subsequently mounted on a small circuit board; the circuit board assembly is then mounted within a rear connector body element or “trailer.” As can be seen in
FIG. 1
, the trailer
100
is received by the front connector body
102
, which also receives the modular plug (not shown). As shown in
FIG. 1
, a separate lead “carrier”
104
is also commonly used to maintain electrical separation between the leads
106
which mate with the modular plug. The lead carrier
104
is typically molded onto the leads (at a location between the trailer and the distal end of the leads) in a separate process step. See, for example, U.S. Pat. No. 5,587,884 assigned to the Whitaker Corporation, which describes a connector design incorporating both a trailer with circuit board and lead carrier.
However, the fabrication of such prior art connector designs typically requires a significant number of processing steps and labor, thereby increasing cost, and further necessitating the allocation of a significant volume within the connector to the component package, circuit board, and trailer. The additional volume within the connector required by these components may dictate the use of a larger connector body than would otherwise be necessary. This is a substantial detriment, since space conservation is a prime consideration with any electrical component, including connectors. Furthermore, the additional components and process steps associated with fabrication of the component package, trailer, and carrier, and any electrical terminals associated therewith may also ultimately affect both the cost and reliability of the connector as a whole.
Microelectronic connectors may also suffer from internal component failure or damage during use. In this case, the failed connector often must be entirely replaced. However, typical prior art connectors are often not easily removed from their mounting for replacement. Furthermore, when mounted in multiple configurations (such as in side-by-side groupings), the replacement of one. defective connector often necessitates the replacement of all connectors within the configuration. This produces the unnecessary cost of replacing components which have not failed. Modular connector arrangements have been suggested in the prior art; however, such arrangements do not allow variation of the connector grouping configuration (e.g., either vertically or horizontally) using the same connector and mounting hardware.
Accordingly, it would be most desirable to provide an improved low cost and replaceable connector which would 1) reduce the internal connector volume required to house the necessary electrical components; 2) allow for a simpler, more cost effective, and more reliable method of connector fabrication; 3) facilitate replacement without the need for desoldering and/or replacement of other components on the circuit board in the event of connector failure; and 4) permit the user to configure multiple connectors in both an over-under and/or side-by-side arrangement.
SUMMARY OF THE INVENTION
The present invention satisfies the aforementioned needs by providing an improved, simplified microelectronic connector and method of fabricating the same.
In a first aspect of the invention, an improved microelectronic connector is disclosed which utilizes magnetics or other electrical components embedded directly within a cavity in the rear portion of the connector body. The component leads are terminated to exposed leads in the connector body using bendable leadwire crimps which then may be soldered or otherwise bonded if desired. The components and terminated leads are sealed within the cavity using a standard epoxy or other insulating compound, thereby obviating the need for a separate component package and leads and allowing for reduced connector body dimensions.
In a second aspect of the invention, an improved microelectronic connector having a modular construction and the previously described embedded electrical component(s) is disclosed. The aforementioned connector body includes one or more apertures therein which receive respective pins mounted on a connector carrier so as to hold the connector body to the carrier. A transverse land and groove arrangement is also included within the upper and lower mating surfaces of the connector body. The carrier is then fixed to a circuit board or other structure. In this fashion, one or more connector bodies may be attached to the carrier in vertical and/or horizontal arrangement, and any single connector may be removed or replaced as desired.
In a third aspect of the invention, an improved method is disclosed for fabricating a microelectronic connector having embedded internal components. The connector body with cavity is formed using injection molding or other conventional techniques. The electrical components are placed within the cavity and component leads are routed and terminated to the appropriate connector leads using a mechanical crimp. The crimped leads are then bent into place within the cavity, and the cavity is filled with a liquid epoxy or other suitable compound which insulates the component and leads and prevents further movement thereof.
REFERENCES:
patent: 4695115 (1987-09-01), Talend
patent: 4726638 (1988-02-01), Farrar et al.
patent: 4772224 (1988-09-01), Talend
patent: 4995834 (1991-02-01), Hasegawa
patent: 5011438 (1991-04-01), Awbrey
patent: 5015204 (1991-05-01), Sakamoto et al.
patent: 5015981 (1991-05-01), Lint et al.
patent: 5069641 (1991-12-01), Sakamoto et al.
patent: 5139442 (1992-08-01), Sakamoto et al.
patent: 5178563 (1993-01-01), Reed
patent: 5282759 (1994-02-01), Sakamoto et al.
patent: 5397250 (1995-03-01), Briones
patent: 5399107 (1995-03-01), Gentry et al.
patent: 5403207 (1995-04-01), Briones
patent: 5456619 (1995-10-01), Belopolsky et al.
patent: 5475921 (1995-12-01), Johnston
patent: 5587884 (1996-12-01), Raman
patent: 5647767 (1997-07-01), Scheer et al.
patent: 5687233 (1997-11-01), Loudermilk et al.
patent: 5736910 (1998-04-01), Townsend et al.
patent: 5766043 (1998-06-01), Talend
patent: 5872492 (1999-02-01), Boutros
patent: 5876239 (1999-03-01), Morin et al.
patent: 5928005 (1999-07-01), Li et al.
patent: 654865 (1995-05-01), None
patent: WO94/05059 (1994-03-01), None
Knobbe Martens Olson & Bear LLP
Pulse Engineering Inc.
Witkowski Stanley J.
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