Modular method for chemical mechanical planarization

Details Modular method for chemical mechanical planarization Modular method for chemical mechanical planarization

2005-02-15

2005-02-15

Nguyen, George (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S041000, C451S057000, C451S066000, C451S067000, C700S099000

Reexamination Certificate

active

06855030

ABSTRACT:
Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP module and at least one cleaning module to process one or more substrates therein. The plurality of modules are controllable separately by individual controllers associated separately with the modules. One of the modules is disengaged from the docking station, and is mechanically removed to free the module from the docking station, while the other modules are still operable to process the one or more substrates therein.

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