Modular jack assembly

Details Modular jack assembly Modular jack assembly

1996-06-14

1998-01-06

Nguyen, Khiem

Electrical connectors

With indicating or identifying provision

Connection indicating provision

439676, H01R 300

Patent

active

057048029

ABSTRACT:
A modular jack assembly includes a housing having a plug-receiving cavity and an LED assembly attached atop the plug receiving cavity. In a preferred embodiment, the LED assembly is integrally formed with the housing. The LEDs are encased within the LED assembly, being separated from the plug-receiving cavity by a partition. This isolation of the LED helps to minimize the coupling of EMF interference radiated by the leads of the LED while they are operating to the underlying contact pins. Contact pins disposed within the plug-receiving cavity each have a contacting portion which extends along the roof of the cavity. The contacting portions have a varying measure of separation from the roof along their extent. This provides further separation from the LED leads which are disposed above the contact pins in the LED assembly, further lessening the EMF coupling with the LED leads. In an alternate embodiment, the modular jack has a stacked form factor and can be ganged to form a bank of modular jacks.

REFERENCES:
patent: 4425018 (1984-01-01), Stenz
patent: 4978317 (1990-12-01), Pocrass
patent: 5419720 (1995-05-01), Chen
patent: 5478261 (1995-12-01), Bogese, II
patent: 5613876 (1997-03-01), Bell, Jr.

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