Modular interface for monolithic millimeter wave antenna array

Details Modular interface for monolithic millimeter wave antenna array Modular interface for monolithic millimeter wave antenna array

1986-09-10

1988-09-13

Laroche, Eugene R.

Communications: radio wave antennas

Antennas

With coupling network or impedance in the leadin

333245, 333260, 357 80, 357 81, 361388, 361392, 174 16HS, H05K 332, H01Q 2300

Patent

active

047712945

ABSTRACT:
A signal interface/package for MMIC components comprises a laminate of RF chips, socket carrier, wiring board and cold plate/waveguide structure. Input/output pins of the chip modules interface with feed-through connectors of the carrier. Each chip module is formed of a ceramic substrate which rests atop a heat conductive metallic baseplate. RF coupling ports extend through the baseplate. A coldplate element has a plurality of depressions and pillars, with each depression conforming with the shape of the baseplate. Printed wiring boards contain interconnect wiring layers to connect the signal pins to the outside world. The bottom surface of the coldplate defines a waveguide cavity structure.

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