Modular, hybrid integrated circuit assembly

Details Modular, hybrid integrated circuit assembly Modular, hybrid integrated circuit assembly

1979-08-30

1981-03-03

James, Andrew J.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361382, 361393, 357 74, 357 75, 357 80, 357 81, H01G 402, H01L 2302, H01L 2316

Patent

active

042544467

ABSTRACT:
A modular, hybrid integrated circuit assembly is disclosed which includes a number of integrated circuit modules which can be assembled together to create any number of different hybrid electronic circuits. The modules are designed to minimize semiconductor device interconnect path lengths to increase the speed and reliability of the resultant hybrid electronic circuit. The integrated circuit modules are preferably substantially disk shaped and are provided with a plurality of contacts on both sides as well as four equally spaced notches formed in their edges. the modules are assembled like a stack of coins so that the contacts of adjacent modules are pressed together. The assembled modules are held together under pressure by a module carrier that is provided with lead-pins formed into a standard DIP configuration. Bus-bars of the module carrier engage at least some of the notches of the modules to electrically couple the modules to the lead-pins.

REFERENCES:
patent: 3239719 (1966-03-01), Shower
patent: 3305705 (1967-02-01), Tillmanns et al.
patent: 3323022 (1967-05-01), DaCosta
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patent: 3549949 (1970-12-01), Granberry
patent: 3555364 (1971-01-01), Matcovich
patent: 3706010 (1972-12-01), Laermer et al.
patent: 3875478 (1975-04-01), Capstick
patent: 3914878 (1975-10-01), Lu
patent: 4137559 (1979-01-01), Reuting

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