Modular high-frequency oscillator structure

Oscillators – Plural oscillators

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Details

361792, 361794, 174260, 174261, 29593, 29412, 29413, 29414, H01R 4300

Patent

active

060284897

ABSTRACT:
A modular high-frequency oscillator structure utilizes a master circuit board to form a plurality of oscillator units. The master circuit board has an upper, middle and lower copper foil layer. The upper copper foil layer has a plurality of component circuit patterns and a plurality of positive voltage, ground and signal regulation circuit patterns. The middle copper foil layer has a plurality of power transfer and ground transfer circuit patterns. The lower copper foil layer has a large common ground circuit pattern. The master circuit board is etched in such a manner that the upper and lower copper foil layers are cut through to isolate each oscillator unit and the middle copper foil layer remains uncut.

REFERENCES:
patent: 5488765 (1996-02-01), Kubuta et al.

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