Refrigeration – Structural installation – With electrical component cooling
Reexamination Certificate
2008-07-22
2008-07-22
Jiang, Chen-Wen (Department: 3744)
Refrigeration
Structural installation
With electrical component cooling
C165S104330, C361S688000
Reexamination Certificate
active
07401472
ABSTRACT:
A refrigeration system module including a frame, a heating plate having a fluid inlet and a fluid outlet and a first heat transfer surface, a cooling plate having a fluid inlet and a fluid outlet and a second heat transfer surface, an expansion device disposed between the heating and cooling plates and in fluid communication with the heating plate fluid outlet and the cooling plate fluid inlet, and a hermetic compressor assembly. The compressor assembly is disposed between the heating and cooling plates and has a discharge outlet in fluid communication with the heating plate inlet, and a suction inlet in fluid communication with the cooling plate fluid outlet. The heating plate, the cooling plate, the expansion device and the compressor are fixed to the frame, and the first and second heat transfer surfaces each at least partially define an exterior surface of the module.
REFERENCES:
patent: 3074244 (1963-01-01), Malaker et al.
patent: 3736761 (1973-06-01), Richmond et al.
patent: 3991585 (1976-11-01), Mulder
patent: 4392362 (1983-07-01), Little
patent: 4489570 (1984-12-01), Little
patent: 4928502 (1990-05-01), Kumada et al.
patent: 4979368 (1990-12-01), Stetson
patent: 5111665 (1992-05-01), Ackermann
patent: 5165243 (1992-11-01), Bennett
patent: 5303555 (1994-04-01), Chrysler et al.
patent: 5323293 (1994-06-01), Angiulli et al.
patent: 5349823 (1994-09-01), Solomon
patent: 5457956 (1995-10-01), Bowman et al.
patent: 5491980 (1996-02-01), Yingst et al.
patent: 5673561 (1997-10-01), Moss
patent: 5711156 (1998-01-01), Matsui et al.
patent: 5794450 (1998-08-01), Alexander
patent: 5839295 (1998-11-01), Lehmann
patent: 5862038 (1999-01-01), Suzuki et al.
patent: 5896922 (1999-04-01), Chrysler et al.
patent: 5934364 (1999-08-01), Chrysler et al.
patent: 6034872 (2000-03-01), Chrysler et al.
patent: 6035655 (2000-03-01), Hare et al.
patent: 6148635 (2000-11-01), Beebe et al.
patent: 6205791 (2001-03-01), Smith, Jr.
patent: 6205803 (2001-03-01), Scaringe
patent: 6209328 (2001-04-01), Kim et al.
patent: 6216467 (2001-04-01), O'Neil et al.
patent: 6236566 (2001-05-01), Regnier et al.
patent: 6256999 (2001-07-01), Chase
patent: 6266963 (2001-07-01), Rudick
patent: 6272866 (2001-08-01), Tsai et al.
patent: 6272867 (2001-08-01), Barrash et al.
patent: 6345512 (2002-02-01), Cosley et al.
patent: 6366462 (2002-04-01), Chu et al.
patent: 6393853 (2002-05-01), Vukovic et al.
patent: 6397618 (2002-06-01), Chu et al.
patent: 6437979 (2002-08-01), Unrein
patent: 6438984 (2002-08-01), Novotny et al.
patent: 6493223 (2002-12-01), Viswanath et al.
patent: 6519955 (2003-02-01), Marsala
patent: 6533031 (2003-03-01), Garcia et al.
patent: 6567269 (2003-05-01), Homer et al.
patent: 6687122 (2004-02-01), Monfarad
patent: 6729383 (2004-05-01), Cannell et al.
patent: 6796372 (2004-09-01), Bear
patent: 2003/0043542 (2003-03-01), Monfarad
patent: 2003/0070789 (2003-04-01), Mueller et al.
patent: 2003/0070799 (2003-04-01), Mueller et al.
Baker & Daniels LLP
Jiang Chen-Wen
Tecumseh Products Company
LandOfFree
Modular heating or cooling system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Modular heating or cooling system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modular heating or cooling system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2799334