Modular heat sinks

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Reexamination Certificate

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Details

C385S088000, C257S675000, C257S706000, C257S717000, C257S718000, C257S720000

Reexamination Certificate

active

06916122

ABSTRACT:
The invention relates to modular heat-dissipating housing covers for opto-electronic modules, e.g. transceivers. The housing covers according to the present invention are constructed out of various different parts, which provide different levels of heat dissipation depending on the desired implementation, while maintaining a seal against EMI leakage. Extra heat sinking portions are provided to dissipate heat generated from specific heat generating sources. The extra heat sinking portions are configured into a shape and/or out of a material that provides more thermal dissipation than the standard cover provided. Independent control over the different heat sinking portions enables a better fit and appropriate dissipation.

REFERENCES:
patent: 5202943 (1993-04-01), Carden et al.
patent: 5397919 (1995-03-01), Tata et al.
patent: 5808236 (1998-09-01), Brezina et al.
patent: 6811326 (2004-11-01), Keeble et al.

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