Modular hardware packaging apparatus

Details Modular hardware packaging apparatus Modular hardware packaging apparatus

1978-06-30

1979-12-18

Abrams, Neil

Geometrical instruments

361413, H05K 107

Patent

active

041791720

ABSTRACT:
This relates to a packaging apparatus for coupling modular hardware (e.g. printed circuit boards) to both the bus of a digital system and to industrial end devices such as relays, thermocouples, etc. A motherboard connected to the rear of a card cage couples a first group of edge connectors on each card to the digital system bus. The motherboard has a plurality of clearance holes therein for providing access to a second group of edge connectors on each card. A dedicated terminal assembly having end device field wiring connected thereto is electrically coupled to the second group of edge connectors of a particular card by either passing a suitable connector attached to the assembly through one of the clearance holes or by coupling the second group to the assembly by a suitable cable which passes through the hole.

REFERENCES:
patent: 2951185 (1960-08-01), Buck
patent: 3147404 (1964-09-01), Sinner
patent: 3771101 (1973-11-01), Elkins
IBM Tech. Discl. Bulletin, Berger et al., vol. 11, No. 7, p. 723, 12-1968.

Affiliated with

Also associated with

Rating

Modular hardware packaging apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Modular hardware packaging apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modular hardware packaging apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-451330