Modular floor sub-structure for the operational support of compu

Details Modular floor sub-structure for the operational support of compu Modular floor sub-structure for the operational support of compu

1993-04-23

1994-09-13

Bennet, Henry A.

Refrigeration

Structural installation

With electrical component cooling

62265, 454184, 454186, 361695, 361699, 52799, 521261, F04H 900, F24F 1310

Patent

active

053457790

ABSTRACT:
A modular floor sub-structure is provided wherein discrete floor modules having bottom surfaces and sides extending upwardly to support paired floor tile are interconnected to sit upon a floor surface and, in turn, support rack-mounted computer components. Select ones of the floor modules contain air cooling coils and blowers, while others are provided with uninterrupted power supplies and still others retain power distribution networks. The cooling system of a given module as well as the UPS components of another given module are provided having a capacity for supporting one computer component. Where more than one computer component is to be supported by the system, then additional modules are provided to develop an expanded elevated floor surface with power and heat removal servicing specific to each computer component. In one embodiment, a step arrangement is provided, the interior of which is utilized to retain flexible chilled water conduits for servicing the cooling coils within adjacently disposed floor modules.

REFERENCES:
patent: Re33220 (1990-05-01), Collier
patent: 2867301 (1956-07-01), Benton
patent: 2877990 (1954-02-01), Goeman
patent: 3390347 (1976-01-01), Megumi
patent: 3643389 (1972-02-01), Sheppley
patent: 4508162 (1985-04-01), Radtke
patent: 4566235 (1986-01-01), Groll
patent: 4676036 (1987-06-01), Bessert
patent: 4773196 (1988-09-01), Yoshida et al.
patent: 4858401 (1989-08-01), Thorp et al.
patent: 4874127 (1989-10-01), Collier
patent: 4901487 (1990-02-01), Rigby

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