Modular electronic package

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

Patent

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Details

H05K 710

Patent

active

049185721

ABSTRACT:
Method and apparatus for packaging electronic equipment comprise a housing and a "midplane" that is removably secured to suitable flanges centrally located within the housing. Individual sub-modules (CPU, disk drive, I/O unit, power supply, etc.) have suitable electrical connectors which mate with corresponding connectors on the midplane. The sub-modules are inserted into the midplane from different sides of the housing. The exposed, outer surfaces of the sub-modules may either be finished in final form, or suitable bezels may be placed over the sides of the housing so that the sub-modules can be appropriately accessed for necessary replacement or repair.

REFERENCES:
patent: 4602164 (1986-07-01), Gore et al.

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