Modular electronic enclosure with cooling design

Details Modular electronic enclosure with cooling design Modular electronic enclosure with cooling design

2005-12-27

2005-12-27

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C361S691000, C361S694000, C174S016100, C165S080300, C454S184000

Reexamination Certificate

active

06980435

ABSTRACT:
An embodiment of a modular electronic enclosure is provided as including a chassis having a first portion defining a first compartment, and a second portion defining a second compartment. First and second replaceable units are replaceably received within the first and second compartments, respectively. The modular electronic enclosure also has a fan unit that is replaceably received within a compartment defined by the first portion or the second portion. The fan unit is configured to pull in cooling air through the first portion and exhaust pressurized cooling air through the second portion. A method of cooling a modular electronic enclosure defining first and second compartments is also provided.

REFERENCES:
patent: 6025989 (2000-02-01), Ayd et al.
patent: 6031717 (2000-02-01), Baddour et al.
patent: 6115250 (2000-09-01), Schmitt
patent: 6574100 (2003-06-01), Anderson
patent: 6700778 (2004-03-01), Wang

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