Modular die sockets with flexible interconnects for packaging ba

Details Modular die sockets with flexible interconnects for packaging ba Modular die sockets with flexible interconnects for packaging ba

1998-05-04

2000-07-18

Stephan, Steven L.

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

439 67, H01R 2370

Patent

active

060899204

ABSTRACT:
A modular bare die socket assembly 10 for attaching a plurality of miniature semiconductor dice 18 to a substrate. The socket assembly 10 is comprised of a plurality of two-sided plates 14 joined vertically in a horizontal stack, wherein each plate 14 has a die socket 22 for the removable insertion of a bare semiconductor die 18. A multi-layer interconnect lead tape 50 has a plurality of lithographically formed leads bent on one end to form nodes 88 for attachment to bond pads 90 on the removably inserted semiconductor die 18, and having opposing ends 92 connectable to the substrate.

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