Modular device to be inserted into a vehicle bumper

Details Modular device to be inserted into a vehicle bumper Modular device to be inserted into a vehicle bumper

2000-02-18

2001-11-20

Pape, Joseph D. (Department: 3612)

Vehicle fenders

Buffer or bumper type

Combined

C293S102000

Reexamination Certificate

active

06318774

ABSTRACT:

BACKGROUND INFORMATION
The invention is based on an arrangement having a module for installation in a bumper of a motor vehicle according to the species of the main claim. It is already known to build modules into a bumper which are configured, for example, as ultrasonic sensors for measuring distance. In this context, the housing of the module is inserted into a corresponding bore of the bumper and is secured there. For influencing the detection range, a baffle plate is then additionally attached which partially covers the ultrasonic sensor. An arrangement of this type is known, for example, from German Patent No. 39 39 387. This arrangement, for design reasons, is not entirely desirable since the parts of the module are configured to be raised with respect to the bumper blade and as a result detract from the appearance. In addition, a sensor of this type is relatively conspicuous so that it can easily be damaged, particularly by children at play.
SUMMARY OF THE INVENTION
The contrast, the arrangement of the module according to the present invention has the advantage that the module is installed so as to be flush with the surface of the bumper and is therefore hardly noticeable. An arrangement of this type practically has no impact on the design of the motor vehicle since only a small head piece of the module is visible. The retaining part of the module is mounted behind the bumper blade and is therefore not visible from the exterior.
It is particularly advantageous to join the retaining part fixedly to the bumper using adhesives, injection-molding, or welding, so that it is fixed in place. The module is then introduced into the retaining part and is attached to the retaining part by a clip device, so that the module, on the one hand, is fixed, and, on the other hand, can be separated from the retaining part in the event of a repair.
In order that the module appear as inconspicuous as possible, its head piece is advantageously introduced into a bore of the bumper and is configured to be flush with an adjoining exterior surface of the bumper. It is advantageous if only a small gap can be seen. If the module is an ultrasonic sensor for measuring distance, then the gap advantageously functions for the acoustical decoupling from the bumper.
Furthermore, it is favorable to design the module in the color of the bumper, so that the module becomes as inconspicuous as possible.
As a result of installing the module from the rear side of the bumper, an undesirable disassembly of the module is made significantly more difficult.


REFERENCES:
patent: 3794997 (1974-02-01), Nishibu et al.
patent: 6039367 (2000-03-01), Muller et al.
patent: 39 39 387 (1991-06-01), None
patent: 195 28 474 (1997-02-01), None
patent: 0 466 034 (1992-01-01), None
patent: 2 287 917 (1995-10-01), None
patent: 97 26155 (1997-07-01), None

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