Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge
Patent
1989-01-25
1991-02-12
Briggs, William
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With mating connector which receives panel circuit edge
439 79, 439636, H01R 909
Patent
active
049920529
ABSTRACT:
A modular connector system wherein modules with high contact element density may be surface mounted to a printed circuit board. The connector modules achieve high contact element density by mutually displacing or offsetting the ends of adjacent contact elements in the same column in the direction of the row which extends in the longitudinal direction of the connector housing. The displaced ends are connected by surface mounting means to contact surfaces on the printed circuit board. A unique contact design is disclosed which can be used also in cable and other types of connectors. The modules construction permits many and different types of connectors to be mounted readily to a printed circuit board.
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IBM Tech Disclosure Bulletin, vol. 32, No. 5A, Oct. 1989, "High Density Edge Connector".
IBM Tech Disclosure Bulletin, vol. 30, No. 8, Jan. 1988, "Contractor Expansion of Electrical Connectors".
Briggs William
E. I. Du Pont de Nemours and Company
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