Electrical connectors – With guiding means for mating of coupling part – For guiding side of movable panel – e.g. – circuit board
Reexamination Certificate
2000-03-07
2001-11-06
Sircus, Brian (Department: 2839)
Electrical connectors
With guiding means for mating of coupling part
For guiding side of movable panel, e.g., circuit board
C439S327000
Reexamination Certificate
active
06312279
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
This invention relates to devices for receiving modular components and, more particularly, to devices and methods for installing modular electronic components in computer systems.
BACKGROUND OF THE INVENTION
Computer systems and other electronic systems use numerous modular components. These modular components can provide substantial flexibility in system configuration. This flexibility in system configuration allows manufacturers to adapt or customize a basic system design to meet the needs of a broad range of customers.
One common example of modular componentry used in digital computer systems is random access memory (RAM). The RAM found in personal computer systems or workstations commonly comprises one or more memory modules, each module having a circuit board or other substrate carrying one or more individually packaged memory circuit chips. These memory modules include an electrical contact arrangement positioned along one edge of the substrate. Each memory module is operatively connected to the computer system by inserting the contact arrangement edge of the module into a receptacle or connector associated with a module receiving arrangement mounted on the system motherboard.
Relatively low-end computers systems may include only a single, relatively low capacity memory module installed in the module receiving structure. Manufacturers may accommodate customers desiring more memory capacity by simply installing a higher capacity module in an available receiving structure or installing memory modules in each of the several receiving structures commonly provided on a system motherboard. A user may also readily switch out memory modules as desired to increase or decrease the RAM available in the system.
Numerous different types of modular component receiving structures have been developed for receiving the various types of modular components which may be used in electronic systems. A receiving structure for receiving an electronic modular component will include a receptacle or connector for receiving and making electrical contact with the various elements of a contact arrangement associated with the modular component. The modular component receiving structure will also generally include an arrangement for ensuring good electrical contact is maintained between the connector and module contact arrangement. This arrangement for ensuring good electrical contact may be integral with the receptacle or connector itself and/or may include separate locking arrangements for physically locking the modular component in a proper installed position.
A popular receiving structure for memory modules such as single in line memory modules (SIMMs) and dual in line memory modules (DIMMs), for example, includes an elongated base having a connector receptacle and a locking arrangement. A memory module is installed in this type of receiving structure by first aligning the contact arrangement edge of the module with the connector receptacle and then pressing the edge into the receptacle to an installed position in which electrodes within the connector make good electrical contact with the contact elements on the module. Once the module is pressed into the installed position, the locking members may be pivoted into contact with a feature on the module. This contact between the locking members and module physically retains the module in the installed position.
Although designs utilizing modular components are very popular with system manufacturers and users alike, there remain significant problems associated with the use of modular components. Properly installing a modular component requires a certain level of skill and training. For example, the proper amount of force must be applied to push the module into the receptacle. Applying too much force could damage the module or receiving structure, while applying insufficient force could leave the module improperly installed. Care must also be taken to handle the module properly and apply the installation force at the proper locations on the module. SIMMs and DIMMs are preferably handled by the ends of the module and the manually applied installation force is best applied at the ends of the module. Handling the memory module improperly or applying force at the wrong points could damage the module.
The skill required to install modular components in prior receiving structures is of particular concern to manufacturers. Perhaps the most immediate concern is the cost of training system assemblers. Costs resulting from improper modular component installation include the costs of technical support, costs associated with returns, and the loss of goodwill associated with system failures.
Another problem relating to the use of modular components involves physical security. Modular components are intended to be easily installed and removed. Unfortunately, the ease with which modular components made the removed from a system applies not only to the system owner or user, but also others who may be intent on absconding with a modular component installed in another's system.
SUMMARY OF THE INVENTION
It is an object of the invention to provide a modular component guide structure which overcomes the above-described problems and others associated with modular component receiving structures. The invention includes a complete modular component receiving structure, a guide for use with a prior art modular component receiving structure, and a computer system incorporating the new modular component receiving structure. The invention further encompasses a modular component installation method facilitated by the new receiving structure and guide structure.
These objects are accomplished with a modular component receiving structure which includes a special guide structure for guiding the modular component into a proper installed position and for ensuring that the module is handled properly during installation. Furthermore, a drive arrangement may be included with the guide structure for use in applying a proper installation force to move the memory module into a proper installed position. The drive arrangement facilitates the use of a rotary tool to apply the installation force. Using the rotary tool eliminates the manual application of force previously required to properly install modular components such as RAM modules in a computer system.
A modular component receiving structure according to the invention includes a connector for operatively connecting with a modular component in an installed position in the receiving structure. This connector may be similar to prior connectors used in modular component receiving structures. However, the present receiving structure further includes a guide structure having a guide opening aligned with the connector. The alignment between the guide opening and connector allows the modular component to extend through the guide opening and into proper contact with the connector when the modular component is moved to the installed position. An upper portion of the guide structure is adapted to cover a distal edge of the modular component when the component is in the installed position. However, access features associated with the guide structure leave proper contact points of the modular component exposed when the component is in the installed position. This covering or enclosure of the modular component distal edge, while leaving proper contact points exposed forces the installer to contact the module at the proper points while placing the module in the guide structure. Thus, the combination providing structure to cover the distal edge of the modular component while providing access to proper contact points on the component helps ensure that the modular component is properly handled during installation.
The drive arrangement according to the invention includes a drive opening positioned in the upper portion of the guide structure. This drive opening has a longitudinal axis extending generally perpendicular to the longitudinal dimension of the guide opening. The drive opening is also threaded about its longit
Gill Stephen
Manley Mark
Pobst Forrest
Rachui Roy
Sloan Robert C.
Dell Products L.P.
Hyeon Hae Moon
Sircus Brian
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