Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1992-12-24
1993-12-28
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439526, H01R 2372
Patent
active
052734420
ABSTRACT:
A modular chip carrier socket of integral construction and method of making the same for electrically engaging the leads of an integrated chip carrier to the conductors on a substrate that structurally simulates the monolithic molded plastic construction of chip carrier specific sockets. Where the modular socket is designed for minimal lead time manufacture of nonstandard sockets with limited application specific components. Standard contact modules, supporting contacts therein, are permanently affixed to an application specific base plate to form a socket of modular construction prior to assembly of the socket upon the substrate. An embodiment of the invention has improved thermal characteristics over the molded sockets by using a base plate having the same coefficient of thermal expansion as the substrate.
REFERENCES:
patent: 4530554 (1985-07-01), Velsher et al.
patent: 4699593 (1987-10-01), Grabbe et al.
patent: 5007845 (1991-04-01), Grabbe et al.
patent: 5062802 (1991-11-01), Grabbe
patent: 5236367 (1993-08-01), McHugh et al.
Abrams Neil
Nina, Jr. Driscoll A.
The Whitaker Corporation
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