Modified substrate and process for production thereof

Details Modified substrate and process for production thereof Modified substrate and process for production thereof

2006-03-28

2011-12-06

Kim, John (Department: 1777)

Liquid purification or separation

Processes

Utilizing electrical or wave energy directly applied to...

C210S500230, C210S500240, C210S500350, C210S506000, C210S636000, C210S748070, C210S748080, C210S748100, C422S022000, C422S024000

Reexamination Certificate

active

08070964

ABSTRACT:
The present invention is characterized in that a base material comprises ester groups in the main chain and/or in the side chain(s), and comprises a polymer having hydrophobic groups. Particularly, the hydrophobic groups can be introduced by irradiating the base material with a radiation during the base material contacts an aqueous solution of a monohydric alcohol or an aqueous solution of an alcohol having not less than 2 hydroxyl groups, which is a monomer or a polymer, and which has one or more carbon atoms between the carbon atoms to each of which the hydroxyl group is bound in the monomer or in each monomer constituting the polymer.

REFERENCES:
patent: 0 672 424 (1995-09-01), None
patent: 1 535 657 (2005-06-01), None
patent: 63-209663 (1988-08-01), None
patent: 7-328112 (1995-12-01), None
patent: 2000-135421 (2000-05-01), None
Database WPI Week 199335, Derwent Publications Ltd., London, GB; AN 1993-277527, XP002479016.
Database WPI Week 199212, Derwent Publications Ltd., London, GB; AN 1992-091525, XP002479017.

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