Modified polyethylene based hot-melt adhesives for use in packag

Details Modified polyethylene based hot-melt adhesives for use in packag Modified polyethylene based hot-melt adhesives for use in packag

1993-10-01

1995-01-17

Schofer, Joseph L.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524277, 524487, 524488, 524489, 524522, 524523, 524570, C08L 3308

Patent

active

053826159

ABSTRACT:
Hot-melt adhesive compositions useful for packaging are disclosed. These hot-melt adhesive compositions are based on modified polyethylene and contain an ethylene-alkylacrylate copolymer, a polyethylene graft copolymer, a tackifying resin, and a high-melting low viscosity wax. The hot-melt adhesive compositions disclosed have fast setting times and a novel combination of desired properties with good high and low temperature bond strength.

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patent: 4146521 (1979-03-01), Godfrey
patent: 4460728 (1984-07-01), Schmidt et al.
patent: 4487885 (1984-12-01), Adur et al.
patent: 4537836 (1985-08-01), Adur et al.
patent: 4752634 (1988-06-01), Goss

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