Modified polyethylene based hot-melt adhesives for use in packag

Details Modified polyethylene based hot-melt adhesives for use in packag Modified polyethylene based hot-melt adhesives for use in packag

1994-11-25

1995-10-17

Smith, Jeffrey T.

Stock material or miscellaneous articles

Composite

Of addition polymer from unsaturated monomers

428522, B32B 2710

Patent

active

054589827

ABSTRACT:
Hot-melt adhesive compositions useful for packaging are disclosed. These hot-melt adhesive compositions are based on modified polyethylene and contain an ethylene-alkylacrylate copolymer, a polyethylene graft copolymer, a tackifying resin, and a high-melting low viscosity wax. The hot-melt adhesive compositions disclosed have fast setting times and a novel combination of desired properties with good high and low temperature bond strength.

REFERENCES:
patent: 3856889 (1974-12-01), McConnell
patent: 4081415 (1978-03-01), Matubara et al.
patent: 4140733 (1979-02-01), Meyer et al.
patent: 4146521 (1979-03-01), Godfrey
patent: 4460728 (1984-07-01), Schmidt et al.
patent: 4487885 (1984-12-01), Adur et al.
patent: 4537836 (1985-08-01), Adur et al.
patent: 4752634 (1988-06-01), Goss

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