Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof
Reexamination Certificate
2000-01-07
2002-06-11
Hampton-Hightower, P. (Department: 1711)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
From carboxylic acid or derivative thereof
C528S322000, C528S403000, C528S425000, C528S480000, C528S486000, C428S343000, C525S418000, C525S419000, C525S420000, C525S422000, C525S423000, C525S430000
Reexamination Certificate
active
06403757
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a modified polyamide resin, a heat-resistant resinous composition containing the same, and an adhesive tape for a semiconductor device comprising the heat-resistant resinous composition. Particularly, the present invention relates to a modified polyamide resin, which is suitably used as polyamide component of epoxy/polyamide adhesive agent having excellent adhesiveness and being used for mounting electric and electronic parts of a flexible printed wiring board, an adhesive member of a semiconductor device, and the like, an heat-resistant resinous composition containing the same, and a three-layered adhesive tape for a semiconductor device, which comprises the heat-resistant resinous composition as an adhesive layer and can be used for mounting ball grid arrays (BARS) mounted in the tape automated bonding (TAB) method.
BACKGROUND OF THE INVENTION
It is well-known that epoxy
ylon adhesive agent has been used for mounting such electric or electronic parts of a flexible wiring board and an adhesive member of a semiconductor device as adhesive agent having excellent adhesiveness and high heat resistance. Since polyamide resin such as nylon is of inferior hygroscopicity and heat-resistance, it is not preferable to increase the proportion of nylon in epoxy
ylon resin. On the other hand, since polyamide resin is not good compatibility with many kinds of epoxy resin, epoxy
ylon adhesive agent comprising higher amount of epoxy resin may not often be of uniform thickness when it is dried, which results in unreliability of adhesiveness and instability of the quality.
The published Japanese Patent Applications No. 5-51447 and No. 5-51571 disclose an epoxy modified polyamide resin having an improved compatibility with epoxy resin.
However, adhesive agents for electronic parts have been recently desired to have more excellent properties, particularly to have more excellent heat-resistance, but epoxy/polyamide adhesive agent containing the above epoxy modified polyamide resin cannot satisfy such a high heat-resistance as to be desired. In order to increase heat-resistance, an adhesive agent containing polyamide resin/resol phenol resin has been developed. However, such adhesive agent exhibit a considerably high curing shrinkage due to dehydro-condensation reaction of resol-type phenol resin, and its warping level is increased when it is used for a flexible printed wiring board and an adhesive member for a semiconductor device such as TAB(Tape Automated Bonding) tape. As the result, misalignment caused by differences in size and conveyance failure occurs in the process of conveyance.
An object of the present invention is to provide a heat-resistant resinous composition having a high heat-resistance, a high adhesive property, and the ability of low curing shrinkage, which are required of adhesive agent for electronic parts.
Another object of the present invention is to provide an adhesive tape for a semiconductor device having an excellent heat-resistance and small warping level, which does not generate any defectives during a process.
DISCLOSURE OF THE INVENTION
A modified polyamide resin of the present invention can be obtainable by a reaction of an acid anhydride compound and epoxy-terminated polyamide having the following structure
wherein R
1
, R
2
, and R
3
each are a bivalent organic group, and m and n each are a natural number.
A heat-resistant resinous composition of the present invention contains the above modified polyamide resin and epoxy resin.
Although a heat-resistant resinous composition of the present invention is not particularly limited, it may have a storage elastic modulus of 30 MPa or more at 300° C. and a 1% weight decreasing temperature of 280° C. or more after being cured.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
Generally, in an adhesive agent of a resinous composition obtained by mixing epoxy resin and polyamide resin, epoxy resin forms cross-links by epoxy resin curing agent, but polyamide resin is not involved in this cross-links at all. For this reason, heat-resistance of a resinous composition is determined by the kind and the proportion of epoxy resin contained in the composition. In order to increase a storage elastic modulus of the composition under a high temperature condition, it is necessary to increase the proportion of epoxy resin. However, such composition does not manifest flexibility after it is cured, so that its adhesive strength is decreased. When this composition is used for a laminate, a warping level of the laminate is increased.
In the present invention, one component of an adhesive composition is allowed to react with epoxy resin to form epoxy-terminated polyamide resin, and thus its compatibility with another component of the adhesive composition, i.e. epoxy resin, is increased. Then, epoxy-terminated polyamide resin is reacted with acid anhydride compound to introduce carboxy group into a resin skeleton. This carboxy group can be reacted with epoxy resin when the composition is prepared. Since carboxy group capable of reacting with epoxy resin is introduced into a skeleton of polyamide resin, polyamide resin is involved in cross-linking reaction when an adhesive agent is cured. Accordingly, the cross-linking density is increased throughout the composition and a storage elastic modulus is increased at a high temperature condition.
Thus, a heat-resistant resinous composition having the ability of low curing shrinkage and high heat-resistance can be obtained by mixing a modified polyamide resin and an epoxy resin. More concretely, a heat-resistant resinous composition having a storage elastic modulus of 30 MPa or more at 300° C. and a 1% weight decreasing temperature of 280° C. or more can be obtained.
Preferred embodiments of the present invention will be described in detail below.
In the present invention, epoxy-terminated polyamide, which is to be reacted with acid anhydride compound, can be synthesized by using a method disclosed in the published Japanese Patent Application No. 5-51447 or No. 5-51571. Concretely, epoxy-terminated polyamide is a reactant of carboxy-terminated polyamide and epoxy resin, and carboxy-terminated polyamide (“Carboxy-terminated polyamide” used herein means polyamide having carboxy groups at both termini of its molecule) can be obtained by a reaction of dicarboxylic acid compound with diamine compound or diisocyanate compound. Dicarboxylic acid compound used in the present invention is not particularly limited. For example, adipic acid, sebacic acid, dodecane dicarboxylic acid and dimer acid can be used alone or in combination of two or more. It is preferable to use dimer acid, because polyamide having a low hygroscopicity can be obtained by using dimer acid. Any dimer acid can be used, as far as it is derived from unsaturated fatty acid. Dimer acid may contain monomer acid, trimer acid or the like, or it may be hydrogenerated dimer acid whose double bond(s) is/are saturated. For example commercially available products can also be used as dimer acid.
A diamine compound or a diisocyanate compound to be reacted with dicarboxylic acid is not particularly limited. For example, hexamethylene diisocyanate, toluene diisocyanate, diphenylmethane diisocyanate, isophorone diisocyanate, and diamine compounds thereof can be used alone or in combination of two or more. If a diamine or diisocyanate compound having a following structure
wherein X represents —NH
2
or —NCO, is used in the reaction, a resultant composition has excellent heat-resistance and hygroscopic resistance.
Carboxy-terminated polyamide can be obtained by a known method in which diamine compound is added to dicarboxylic acid. Alternatively, carboxy-terminated polyamide can be obtained by a reaction of dicarboxylic acid and diisocyanate compound, and more concretely, dicarboxylic acid and diisocyanate compound are reacted in an organic solvent such as N-methyl pyrrolidone (NMP) or dimethylformamide(DMF) with heating.
The weight-average molecular weight of carboxy-terminated polyamide preferably ranges
Akahori Kiyokazu
Nishikawa Yasushi
Yabuta Katsunori
Fitch Even Tabin & Flannery
Hampton-Hightower P.
Kanegafuchi Kagaku Kogyo Kabushiki Kaisah
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